CWE-1384 · Słabość
Improper Handling of Physical or Environmental Conditions
- Abstrakcja
- Klasa
- Status
- Niekompletny
- Dodano
- 21 kwietnia 2022
- Ostatnia zmiana
- 11 grudnia 2025
Opis
The product does not properly handle unexpected physical or environmental conditions that occur naturally or are artificially induced.
Hardware products are typically only guaranteed to behave correctly within certain physical limits or environmental conditions. Such products cannot necessarily control the physical or external conditions to which they are subjected. However, the inability to handle such conditions can undermine a product's security. For example, an unexpected physical or environmental condition may cause the flipping of a bit that is used for an authentication decision. This unexpected condition could occur naturally or be induced artificially by an adversary.
Physical or environmental conditions of concern are:
- **Atmospheric characteristics: ** extreme temperature ranges, etc.
- **Interference: ** electromagnetic interference (EMI), radio frequency interference (RFI), etc.
- **Assorted light sources: ** white light, ultra-violet light (UV), lasers, infrared (IR), etc.
- **Power variances: ** under-voltages, over-voltages, under-current, over-current, etc.
- **Clock variances: ** glitching, overclocking, clock stretching, etc.
- **Component aging and degradation**
- **Materials manipulation: ** focused ion beams (FIB), etc.
- **Exposure to radiation: ** x-rays, cosmic radiation, etc.
Skutki
Confidentiality, Integrity, Availability
Varies by Context; Unexpected State
Consequences of this weakness are highly dependent on the role of affected components within the larger product.
Zapobieganie
Requirements
In requirements, be specific about expectations for how the product will perform when it exceeds physical and environmental boundary conditions, e.g., by shutting down.
Architecture and Design, Implementation
Where possible, include independent components that can detect excess environmental conditions and have the capability to shut down the product.
Architecture and Design, Implementation
Where possible, use shielding or other materials that can increase the adversary's workload and reduce the likelihood of being able to successfully trigger a security-related failure.
Przykłady podatności
- CVE-2019-17391 Lack of anti-glitch protections allows an attacker to launch a physical attack to bypass the secure boot and read protected eFuses.
Słabość nadrzędna
Słabości podrzędne
Kiedy powstaje
- Architecture and Design — The product's design might not consider checking and handling extreme conditions.
- Manufacturing — For hardware manufacturing, sub-par components might be chosen that are not able to handle the expected environmental conditions.
Dotyczy
System on Chip, ICS/OT
Źródła
- Categories of Security Vulnerabilities in ICS — Securing Energy Infrastructure Executive Task Force (SEI ETF), ICS Communications / 2. Unreliability, 2022
- Semi-invasive attacks - A new approach to hardware security analysis — Sergei P. Skorobogatov, 2005
- Physical Security Attacks Against Silicon Devices — Texas Instruments, 2022
- On The Susceptibility of Texas Instruments SimpleLink Platform Microcontrollers to Non-Invasive Physical Attacks — Lennert Wouters, Benedikt Gierlichs, Bart Preneel, 1.2, 2022
- The Hard-coded Key to my Heart - Hacking a Pacemaker Programmer — Anders B. Wilhelmsen, Eivind S. Kristiansen, Marie Moe, 2019
Wpis z katalogu CWE 4.20.